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Your search for [subject]Packaging materials returned 12 records. |
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Cassava starch as alternative loosefill packaging material.
by Gonzales, Nikki Korina L.; Quezon City: PSHS, 2002.
Subject: Packaging materials; Cassava starch -- Loosefill packaging material; Environment-friendly packaging materials; Biodegradable packaging materials.
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Plastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications.
New York: Wiley, 1995.
Subject: Microelectronic packaging -- Materials; Microencapsulation; Plastics in packaging.
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Plastics for electronics : materials, properties, and design applications.
by Alvino, William M.; New York: McGraw-Hill, 1995.
Subject: Electronic packaging -- Materials; Electronics -- Materials; Plastics.
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Packaging material from corn husks and feathers: Bato Balani v. 15, no. 2, SY 1995-96.
by Baldivia, Gena; Makati, Metro Manila: Diwa Learning System, 1995.
Subject: Chemical Technology; Feathers -- Packaging material; Packaging materials -- Corn husks -- Feathers; Corn husks as packaging material; Feathers as packaging material.
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Materials for electronic packaging.
Boston: Butterworth-Heinemann, 1995.
Subject: Electronic packaging -- Materials.
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<p>Wheat - a new option for carry-out containers</p>.
by Wood, Marcia;
Subject: Wheats -- Packaging materials -- Starch.
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ITDI reports outstanding achievements for 2000.
Subject: Carrageenan; Sutures; Packaging materials; Seaweed.
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Characterization of integrated circuit packaging materials.
Boston: Butterworth-Heinemann, 1993.
Subject: Electronic packaging -- Materials; Integrated circuits -- Design and construction.
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Characterization of integrated circuit packaging materials.
by Moore, Thomas M.; Boston: Butterworth-Heinemann, 1993.
Subject: Electronic packaging -- Materials; Integrated circuits -- Design and construction.
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Soldering processes and equipment.
New York: Wiley, 1993.
Subject: Electronic packaging -- Materials; Solders and soldering; Surface mount technology.
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