| |
Your search for [subject]Packaging design returned 39 records. |
|
| |
Sort by:
|
|
| |
|
|
| |
|
 |
British packaging now.
London: Internes Books, 1993.
Subject: Packaging -- Great Britain; Packaging -- Design.
|
|
| |
|
|
|
|
| |
|
|
| |
|
|
Power packaging.
New York: Hearst Book International, 1999.
Subject: a*Packaging -- Pictorial works; Packaging -- Design.
|
|
| |
|
|
|
|
| |
|
|
| |
|
|
International brand packaging awards 2.
Rockport, Mass.: Rockport Publishers, 1994.
Subject: Packaging -- Design; Brand name products -- Packaging; Advertising -- Brand name products; Commercial art -- Design; Graphic arts.
|
|
| |
|
|
|
|
| |
|
|
| |
|
|
Specialty food packaging design.
by Alejandro, Reynaldo G.; New York: PBC International, 1989.
Subject: Packaging -- Design; Food -- Packaging.
|
|
| |
|
|
|
|
| |
|
|
| |
|
|
Brand identity.
Tokyo: Graphic-sha, 1990.
Subject: Packaging -- Design; Packaging -- Japan.
|
|
| |
|
|
|
|
| |
|
|
| |
|
|
Special packaging /: Pepin van Roojen.
by Roojen, Pepin van; Amsterdam: Pepin Press/Agile Rabbit Editions, 2004.
Subject: Packaging -- Design; Boxes -- Design; Containers -- Design.
|
|
| |
|
|
|
|
| |
|
|
| |
|
|
Structural package designs.
by Roojen, Pepin van; Amsterdam: Pepin Press/Agile Rabbit Editions, 2003.
Subject: Packaging -- Design; Boxes -- Design; Containers -- Design.
|
|
| |
|
|
|
|
| |
|
|
| |
|
|
Electronics packaging forum : multichip module technology issues.
New York: The Institute of Electrical and Electronics Engineers, 1994.
Subject: Electronic packaging -- Design; Multichip modules (Microelectronics) -- Design and construction.
|
|
| |
|
|
|
|
| |
|
|
| |
|
|
Physical design for multichip modules.
by Sriram, M., (Mysore), 1966-; Boston: Kluwer Academic Pub., 1994.
Subject: Electronic packaging -- Design; Multichip modules (Microelectronics) -- Design and construction.
|
|
| |
|
|
|
|
| |
|
|
| |
|
|
Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability.
by Pecht, Michael; New York: Wiley, 1994.
Subject: Electronic packaging -- Design; Hybrid integrated circuits -- Design and construction; Multichip modules (Microelectronics) -- Design and construction.
|
|
| |
|
|
|
|
| |
|
|
| « Previous 1 2 3 4 Next » |
