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  Search result  Your search for [subject]Packaging -- Design returned 39 records.  
 
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  Book British packaging now.

London: Internes Books, 1993.

Subject: Packaging -- Great Britain; Packaging -- Design.

 
     
Relevance: 15.40%
 
     
  Book Power packaging.

New York: Hearst Book International, 1999.

Subject: a*Packaging -- Pictorial works; Packaging -- Design.

 
     
Relevance: 15.40%
 
     
  Book International brand packaging awards 2.

Rockport, Mass.: Rockport Publishers, 1994.

Subject: Packaging -- Design; Brand name products -- Packaging; Advertising -- Brand name products; Commercial art -- Design; Graphic arts.

 
     
Relevance: 15.02%
 
     
  Book Specialty food packaging design.

by Alejandro, Reynaldo G.; New York: PBC International, 1989.

Subject: Packaging -- Design; Food -- Packaging.

 
     
Relevance: 14.84%
 
     
  Book Brand identity.

Tokyo: Graphic-sha, 1990.

Subject: Packaging -- Design; Packaging -- Japan.

 
     
Relevance: 14.84%
 
     
  Book Special packaging /: Pepin van Roojen.

by Roojen, Pepin van; Amsterdam: Pepin Press/Agile Rabbit Editions, 2004.

Subject: Packaging -- Design; Boxes -- Design; Containers -- Design.

 
     
Relevance: 14.33%
 
     
  Book Structural package designs.

by Roojen, Pepin van; Amsterdam: Pepin Press/Agile Rabbit Editions, 2003.

Subject: Packaging -- Design; Boxes -- Design; Containers -- Design.

 
     
Relevance: 14.33%
 
     
  Book Electronics packaging forum : multichip module technology issues.

New York: The Institute of Electrical and Electronics Engineers, 1994.

Subject: Electronic packaging -- Design; Multichip modules (Microelectronics) -- Design and construction.

 
     
Relevance: 14.30%
 
     
  Book Physical design for multichip modules.

by Sriram, M., (Mysore), 1966-; Boston: Kluwer Academic Pub., 1994.

Subject: Electronic packaging -- Design; Multichip modules (Microelectronics) -- Design and construction.

 
     
Relevance: 14.30%
 
     
  Book Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability.

by Pecht, Michael; New York: Wiley, 1994.

Subject: Electronic packaging -- Design; Hybrid integrated circuits -- Design and construction; Multichip modules (Microelectronics) -- Design and construction.

 
     
Relevance: 13.84%
 
     
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