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Your search for [subject]Multichip modules (Microelectronics) returned 11 records. |
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Introduction to multichip modules.
by Sherwani, N. A., (Naveed A.); New York: Wiley, 1995.
Subject: Multichip modules (Microelectronics).
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Multichip modules and related technologies : MCM, TAB, and COB design.
by Ginsberg, Gerald L.; N.Y.: McGraw, 1994.
Subject: Electronic packaging; Multichip modules (Microelectronics) -- Design and construction.
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The effect of copper oxides on the solder joint reliability of a cu-bumped flip chip package.
by Orofeo, Carlo M.; 2007.
Subject: Microelectronic packaging -- Reliability; Solder and soldering -- Testing; Multichip modules (Microelectronics); Copper oxide superconductor.
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Multichip module technology handbook.
by Garrou, Philip E.; New York: McGraw-Hill, 1998.
Subject: Multichip modules (Microelectronics); Microelectronic packaging; Integrated circuits -- Very large scale integration -- Design and construction.
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Electronics packaging forum : multichip module technology issues.
New York: The Institute of Electrical and Electronics Engineers, 1994.
Subject: Electronic packaging -- Design; Multichip modules (Microelectronics) -- Design and construction.
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Physical design for multichip modules.
by Sriram, M., (Mysore), 1966-; Boston: Kluwer Academic Pub., 1994.
Subject: Electronic packaging -- Design; Multichip modules (Microelectronics) -- Design and construction.
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Multichip modules : systems advantages, major constructions, and materials technologies.
New York: IEEE Press, 1991.
Subject: Electronic packaging; Microelectronic packaging; Multichip modules (Microelectronics).
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Flip chip technologies.
New York: McGraw-Hill, 1996.
Subject: Integrated circuits -- Very large scale integration -- Design and construction; Microelectronic packaging; Multichip modules (Microelectronics) -- Design and construction.
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Microelectronic system interconnections : performance and modeling.
New York: IEEE Press, 1994.
Subject: Microelectronic packaging -- Mathematical models; Multichip modules (Microelectronics) -- Mathematical models; Optical fibers -- Joints -- Mathematical models.
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Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability.
by Pecht, Michael; New York: Wiley, 1994.
Subject: Electronic packaging -- Design; Hybrid integrated circuits -- Design and construction; Multichip modules (Microelectronics) -- Design and construction.
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