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  Search result  Your search for [author]Pecht, Michael returned 7 records.  
 
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  Book Soldering processes and equipment.

New York: Wiley, 1993.

Subject: Electronic packaging -- Materials; Solders and soldering; Surface mount technology.

  
     
Relevance: 16.49%
 
     
  Book Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability.

by Pecht, Michael; New York: Wiley, 1994.

Subject: Electronic packaging -- Design; Hybrid integrated circuits -- Design and construction; Multichip modules (Microelectronics) -- Design and construction.

  
     
Relevance: 16.49%
 
     
  Book Quality conformance and qualification of microelectronic packages and interconnects.

New York: Wiley, 1994.

Subject: Electronic packaging -- Defects; Electronic packaging -- Quality control; Electronic packaging -- Testing; Quality assurance.

  
     
Relevance: 16.49%
 
     
  Book Lead free electronics.

Hoboken, New Jersey: Wiley-Interscience, 2006.

Subject: Electronic apparatus and applicances; Lead-free electronics manufacturing processes.

  
     
Relevance: 16.12%
 
     
  Book Advanced routing of electronic modules.

Boca Raton: CRC Press, 1996.

Subject: Printed circuits -- Design and construction -- Mathematical models; Electronic apparatus and appliances -- Design and construction -- Mathematical models.

  
     
Relevance: 15.95%
 
     
  Book Plastic-encapsulated microelectronics : materials, processes, quality, reliability, and applications.

New York: Wiley, 1995.

Subject: Microelectronic packaging -- Materials; Microencapsulation; Plastics in packaging.

  
     
Relevance: 15.78%
 
     
  Book Physical architecture of VLSI systems.

New York: Wiley, 1994.

Subject: Electronic packaging; Integrated circuits -- Very large scale integration.

  
     
Relevance: 15.61%
 
     
 
         
         
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