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  Search result  Your search for [author]Lau, John H. returned 8 records.  
 
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  Book Chip scale package (CSP) : design, materials, processes, reliability, and applications.

by Lau, John H.; New York: McGraw-Hill, 1999.

Subject: Integrated circuits -- Design and construction; Microelectronic packaging.

  
     
Relevance: 17.21%
 
     
  Book Thermal stress and strain in microelectronics packaging.

New York: Van Nostrand Reinhold, 1993.

Subject: Electronic packaging; Microelectronic packaging; Thermal stresses.

  
     
Relevance: 13.08%
 
     
  Book Ball grid array technology.

New York: McGraw-Hill, 1995.

Subject: Ball grid array technology.

  
     
Relevance: 13.08%
 
     
  Book Electronic packaging : design, materials, process, and reliability.

New York: McGraw-Hill, 1998.

Subject: Electronic packaging.

  
     
Relevance: 13.08%
 
     
  Book Handbook of fine pitch surface mount technology.

New York: Van Nostrand Reinhold, 1994.

Subject: Fine pitch technology; Surface mount technology.

  
     
Relevance: 13.08%
 
     
  Book Chip on board technologies for multichip modules.

New York: Van Nostrand Reinhold, 1994.

Subject: Electronic packaging; Surface mount technology.

  
     
Relevance: 13.08%
 
     
  Book Handbook of fine pitch surface mount technology.

New York: Van Nostrand Reinhold, 1994.

Subject: Fine pitch technology; Surface mount technology.

  
     
Relevance: 13.08%
 
     
  Book Classical Chinese literature : an anthology of translations _ Han ying cheu Hua chi.

New York: Columbia University Press, 2000.

Subject: Chinese literature -- Translations into English; Chinese literature -- History and criticism.

  
     
Relevance: 12.65%
 
     
 
         
         
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