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Your search for [author]Amistoso,Melanio S. returned 10 records. |
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Determinants to community development in Catbalogan, Samar : their implications for peace and order.
by Amistoso,Melanio S.; 1982.
Subject: Community development -- Catbalogan, Samar; Community development, Urban.
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Thesis on hyperopia [microform]. _ Hyperopia.
by Amistoso, Bienvenido V.; Quezon City: Photoduplication Service, University of the Philippines Library, 1974.
Subject: Hyperopia; Eye -- Diseases and defects.
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Responsibilities and education of hospital dietitians and nutritionists in the Greater Manila area.
by Amistoso, Annabelle Y.; 1975.
Subject: Dietitians.
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A comparative study on the yield responses of alugbati (Basella alba Linn.) using varying amounts of ammonium sulfate (21-0-0) applied in solution form.
by Amistoso, Petronilo C.; 1981.
Subject: Alugbati -- Fertilizers and manures; Amonium sulfate as fertilizers.
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Responsibilities and education of hospital dietitians and nutritionists in the Greater Manila area [microform].
by Amistoso, Annabelle Y.; Quezon City: Photoduplication Service, University of the Philippines Library, 1977.
Subject: Dietitians; Manila -- Hospitals -- Food service.
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Responsibilities and education of hospital dietitians and nutritionist in the Greater Manila area.
by Amistoso, Annabelle Y.;
Subject: Dietitians; Hospitals -- Philippines -- Manila -- Food service.
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Phenomenological study of thermal aging effects on intermetallic growth mechanisms and shear strength behavior of wafer level solder bumps.
by Amistoso, Jose Omar S.; 2007.
Subject: Integrated circuits -- Wafer-scale integration; Solder and soldering; Shear (Mechanics).
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Pulsed Laser Deposition (PLD) of titanium Nitride on silicon (100).
by Amistoso, Jose Omar S.; 1999.
Subject: Pulsed laser deposition.
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Pulsed laser deposition (PLD) of titanium nitride on silicon (100).
by Amistoso, Jose Omar S.; 1999.
Subject: Pulsed laser deposition; Titanium nitride; Thin films -- Optical properties.
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Phenomenological study of thermal aging effects on intermetallic growth mechanism and shear strength behavior of wafer level solder bumps.
by Amistoso, Jose Omar S.;
Subject: Solder and soldering; Intermetallic compounds -- Thermal properties; Integrated circuits -- Wafer-scale integration.
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